Course Description
This course provides information on the standards, describes materials, methods, and verification criteria for producing high-quality soldered leaded and lead-free interconnections. It emphasizes process control and establishes industry consensus requirements for a broad range of electronic connections. There are hands-on exercises for component placement and soldering connectivity. Upon completion of the course, the participants will be able to identify component connectivity, identify component requirements, and soldering methods required to successfully assemble a project, and qualify to test for the IPC J-STD-001 certification.
Modules included in the course:
- Wires and Terminals
- PCB, Coating, Encapsulation and Staking
- Through-Hole Connectivity
- Surface Mount Connectivity
- Inspection
Credentials:
IPC J-STD-001 certification, TSTC Certification of Completion
